2026 IEEE Hot Chips Conference Highlights Hardware Innovation and AI Memory Advances

The latest IEEE Hot Chips conference showcased a renewed industry focus on hardware optimization, featuring breakthroughs in high-bandwidth memory (HBM) and three-dimensional DRAM architectures for AI workloads.

26 Aug, 02:24 — 26 Aug, 02:24

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forbes1d ago

Hardware Is Hot Again At The 2026 IEEE Hot Chips Conference

The 2026 Hot Chips Conference showed ways to expand HBM technology, including Samsung’s zHBM as well as other AI memory devices such as D-Matrix’s 3D DRAM.

By Thomas Coughlin, Contributor

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2026 IEEE Hot Chips Conference Highlights Hardware Innovation and AI Memory Advances

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Hardware Is Hot Again At The 2026 IEEE Hot Chips Conference

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